Influences on the Automated Assembly of Hybrid Microsystems with High Accuracy

Nowadays, an ongoing trend of miniaturization of products and components can be observed in nearly all application areas in the world. As for microsystems, a distinction is drawn between monolithic and hybrid microsystems. The latter group requires some kind of assembly process. For the assembly of hybrid microsystems, a high assembly accuracy in the range of a few micrometers is required. In order to reach this accuracy, an assembly system for sensor guided microassembly has been developed at the Collaborative Research Centre 516 “Design and manufacturing of active micro systems”. This paper describes the design of a system for automated assembly of hybrid microsystems. The influences on the accuracy will be analyzed on the basis of an example for an automated assembly process

Automated Assembly of Hybrid Microsystems

The paper describes the design of a system for the automated assembly of hybrid microsystems and the accuracies of the components. The influences on the accuracy will be analyzed on the basis of an example for an automated assembly process. While the object sizes reach centimeter range, they have to be assembled with an assembly accuracy of only a few micrometers. A relative positioning accuracy of 0.8 pm is reached in this process

In-Process Laser Scanning Technology for Micro Assembly

To recognize edges of components in an assembly process, in particular of microelectronic or micro system components, nowadays vision systems are preferred. These systems are working fast but the results strongly depend on ambient conditions. In most sensor guided assembly systems laser displacement sensors are implemented additionally to vision systems. These sensors are used for detection of the components height. In this paper a scanning method is presented that detects edges by using a laser displacement sensor. These data can be used by robot assembly system for a sensor guided assembly process. Further by this technique is extended in order to gain 3D-infonnation of micro components and a proposal of the field of application is outlined